Standardization, Technical principles, Metrology

Standardization, Technical principles, Metrology

145 search results

Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals

Standard [CURRENT] 2003-01

DIN 1304-9:2003-01

Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals

from 50.70 EUR VAT included

from 47.38 EUR VAT excluded

To selection

Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001

Standard [CURRENT] 2001-10

DIN EN 60139:2001-10

Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001

from 121.20 EUR VAT included

from 113.27 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

Standard [CURRENT] 2018-10

DIN EN IEC 60191-1:2018-10

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018

from 145.40 EUR VAT included

from 135.89 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

Standard [CURRENT] 2000-07

DIN EN 60191-3:2000-07

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

from 150.80 EUR VAT included

from 140.93 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

Technical rule [CURRENT] 2006-08

DIN EN 60191-3 Beiblatt 1:2006-08

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

from 58.30 EUR VAT included

from 54.49 EUR VAT excluded

To selection

Standard [CURRENT] 2010-06

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009

This part of DIN EN 60191 contains general rules for the preparation of outline drawings of surface mounted semiconductor devices. It supplements DIN EN 60191-1 and DIN EN 60191-3 with ...

from 145.40 EUR VAT included

from 135.89 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

Standard [CURRENT] 2002-08

DIN EN 60191-6-1:2002-08

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

from 58.30 EUR VAT included

from 54.49 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

Standard [CURRENT] 2002-09

DIN EN 60191-6-2:2002-09

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002

from 80.20 EUR VAT included

from 74.95 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000

Standard [CURRENT] 2001-06

DIN EN 60191-6-3:2001-06

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000

from 65.70 EUR VAT included

from 61.40 EUR VAT excluded

To selection

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

Standard [CURRENT] 2004-01

DIN EN 60191-6-4:2004-01

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003

from 94.60 EUR VAT included

from 88.41 EUR VAT excluded

To selection

Note

If you leave this page your selected items will not be added to the selection. What do you want to do next?

Discard selection and go to the next page