IPC Standards

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Standard [CURRENT] 2022-12-01

IPC JEDEC J-STD-020F:2022-12-01

Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)

IPC/JEDEC J-STD-020F standard is to identify the classification level of nonhermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be ...

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Standard [CURRENT] 2022-12-01

IPC JEDEC J-STD-035A:2022-12-01

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices

IPC/JEDEC J-STD-035A test method defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic devices. IPC/JEDEC J-STD-035A method provides users with an ...

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Standard [CURRENT] 2022-11-01

IPC 9203A:2022-11-01

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle

While there are a variety of industry test vehicles for the examination of material compatibility, the IPC-B-52 test board was created to meet the needs for testing both ion chromatograph and ...

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Standard [CURRENT] 2024-06-01

IPC 2294:2024-06-01

Design Standard for Printed Electronics on Rigid Substrates

IPC-2294 standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates.

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Standard [CURRENT] 2017-09-01

IPC 9505:2017-09-01

Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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Standard [CURRENT] 2017-09-01

IPC 2226A:2017-09-01

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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Standard [CURRENT] 2017-10-01

IPC J-STD-006C AMD 1:2017-10-01

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1

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Standard [CURRENT] 2022-08-01

IPC 7801A:2022-08-01

Reflow Oven Process Control Standard

The IPC-7801A standard provides requirements for process control of conveyorized solder reflow ovens. It includes a methodology for performing temperature measurements over time to establish a ...

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Standard [CURRENT] 2013-07-10

IPC 9641:2013-07-10

High Temperature Printed Board Flatness Guideline

Printed board flatness is largely affected by a change in intrinsic properties through exposure to variances in temperature. The worst case deviation of the printed board from flatness may be at ...

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Standard [CURRENT] 2013-12-09

IPC 9709:2013-12-09

Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that ...

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