IPC Standards

296 search results

  • Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

    Standard [CURRENT] 2017-09-01

    IPC 2226A:2017-09-01

    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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  • Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1

    Standard [CURRENT] 2017-10-01

    IPC J-STD-006C AMD 1:2017-10-01

    Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1

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  • Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires

    Standard [CURRENT] 2019-10-01

    IPC 8921:2019-10-01

    Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires

    The IPC-8921 standard provides and defines industry test methods and guidance for providing performance data on key characteristics and durability of woven and knitted e-textiles integrated with ...

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  • Considerations of New Classes of Coatings for IPC-CC-830 Revision C

    Standard [CURRENT] 2019-09-01

    IPC WP-021:2019-09-01

    Considerations of New Classes of Coatings for IPC-CC-830 Revision C

    The IPC-WP-021 white paper considers conformal coatings, like many high-performance materials, have evolved considerably since the 1990s. New coatings, such as fluoropolymers or hybrid coatings ...

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  • A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

    Standard [CURRENT] 2019-09-01

    IPC WP-026:2019-09-01

    A Review of the Current State of Blockchain Technology and Its Potential Applications in Electronics Manufacturing

    The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These ...

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  • Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

    Standard [CURRENT] 2018-12

    IPC CC-830C:2018-12

    Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

    The IPC-CC-830C standard establishes qualification and conformance requirements for electrical insulating compounds (conformal coatings). It has been designed and constructed with the intent of ...

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  • Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

    Standard [CURRENT] 2018-12

    IPC JEDEC 9301:2018-12

    Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

    The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some ...

    201.20 EUR VAT included

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  • Troubleshooting for Printed Board Assembly Processes

    Standard [CURRENT] 2019-01

    IPC 9111:2019-01

    Troubleshooting for Printed Board Assembly Processes

    250.40 EUR VAT included

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  • Design Guide for Press Fit Rigid Printed Board Back Planes

    Standard [CURRENT] 1982-09

    IPC D-422:1982-09

    Design Guide for Press Fit Rigid Printed Board Back Planes

    118.80 EUR VAT included

    111.03 EUR VAT excluded

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  • Design and End Product Requirements for Discrete Wiring Boards

    Standard [CURRENT] 1990-05

    IPC DW-425A:1990-05

    Design and End Product Requirements for Discrete Wiring Boards

    165.90 EUR VAT included

    155.05 EUR VAT excluded

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