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Standard [CURRENT] 1984-06
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
This item will be ordered specially for you, therefore delivery may take 1 to 2 weeks.
Price on request
Standard [CURRENT] 2001-07-17
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
159.40 EUR VAT included
148.97 EUR VAT excluded
Standard [CURRENT] 1973-11
Measles in Printed Wiring Boards
Standard [CURRENT] 1988-09
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Standard [CURRENT] 2002-07-01
An In-Depth Look At Ionic Cleanliness Testing
203.30 EUR VAT included
190.00 EUR VAT excluded
Standard [CURRENT] 2006-06-22
Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy
Standard [CURRENT] 2009-03-01
Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
Free of charge
Standard [CURRENT] 2020-06-01
Conformal Coating Material and Application "State of the Industry" Assessment Report
240.80 EUR VAT included
225.05 EUR VAT excluded
Standard [CURRENT] 2022-10-01
Requirements and Acceptance for Cable and Wire Harness Assemblies
This document has been modified by: IPC WHMA-A-620E-S:2023-10-01
from 313.50 EUR VAT included
from 292.99 EUR VAT excluded
Standard [CURRENT] 2023-10-01
Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620
191.50 EUR VAT included
178.97 EUR VAT excluded
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