IPC Standards

296 search results

  • Effect of Steam Aging Time and Temperature on Solderability Test Results

    Standard [CURRENT] 1993-07

    IPC TR-465-2:1993-07

    Effect of Steam Aging Time and Temperature on Solderability Test Results

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  • Round Robin Test on Steam Ager Temperature Control Stability

    Standard [CURRENT] 1993-01

    IPC TR-465-1:1993-01

    Round Robin Test on Steam Ager Temperature Control Stability

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  • Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

    Standard [CURRENT] 1984-06

    IPC TR-476A:1984-06

    Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

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  • Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    Standard [CURRENT] 2025-11-01

    IPC T-50P:2025-11-01

    Terms and Definitions for Interconnecting and Packaging Electronic Circuits

    This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader ...

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  • Automotive Applications Addendum to IPC-6012F Qualification and Performance Specification for Rigid Printed Boards

    Standard [CURRENT] 2025-12-01

    IPC 6012FA:2025-12-01

    Automotive Applications Addendum to IPC-6012F Qualification and Performance Specification for Rigid Printed Boards

    The IPC-6012FA Addendum, when required by procurement documentation/drawings, supplements or replaces specifically identified requirements of IPC-6012 revision F, for rigid printed boards that ...

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  • Requirements and Acceptance for Cable and Wire Harness Assemblies

    Standard [CURRENT] 2025-10-01

    IPC WHMA-A-620F:2025-10-01

    Requirements and Acceptance for Cable and Wire Harness Assemblies

    IPC/WHMA-A-620 is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620F describes materials, methods, tests and acceptance ...

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  • Requirement and Acceptance for Organic IC Substrates

    Standard [CURRENT] 2025-12-01

    IPC 6921:2025-12-01

    Requirement and Acceptance for Organic IC Substrates

    This specification establishes and defines the qualification, performance requirements and acceptance requirements for organic IC substrates including wire bonding and flip chip IC substrates ...

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  • Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

    Standard [CURRENT] 2025-11-01

    IPC J-STD-046A:2025-11-01; JEDEC/ECIA/IPC J-STD-046A:2025-11-01

    Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

    This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes.

    118.80 EUR VAT included

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  • Notification Standard for Product Discontinuance

    Standard [CURRENT] 2025-11-01

    IPC J-STD-048A:2025-11-01; JEDEC/ECIA/IPC J-STD-048A:2025-11-01

    Notification Standard for Product Discontinuance

    This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. The goal of this notification standard is to better enable customers ...

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  • Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards; Amendment 1

    Standard [CURRENT] 2026-01-01

    IPC 4413 AMD 1:2026-01-01

    Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards; Amendment 1

    IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the last of ...

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