IPC Standards

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  • Qualification and Performance Specification for Printed Electronics on Rigid Substrates

    Standard [CURRENT] 2024-06-01

    IPC 6904:2024-06-01

    Qualification and Performance Specification for Printed Electronics on Rigid Substrates

    IPC-6904 standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on rigid substrates.

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  • Moisture Sensitivity Classification for Non-IC Components

    Standard [CURRENT] 1999-04-01

    IPC 9503:1999-04-01

    Moisture Sensitivity Classification for Non-IC Components

    This standard identifies the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly ...

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  • Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies

    Standard [CURRENT] 2025-09-01

    IPC J-STD-001JA/A-610JA:2025-09-01; IPC A-610JA:2025-09-01; IPC J-STD-001JA:2025-09-01

    Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies

    IPC J-STD-001JA/IPC-A-610JA is the automotive addendum to J-STD-001J and IPC-A-610J. It provides criteria to ensure the reliability of soldered automotive electrical and electronic assemblies in ...

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  • Specification for Base Materials for Rigid and Multilayer Printed Boards

    Standard [CURRENT] 2026-02-01

    IPC 4101F:2026-02-01

    Specification for Base Materials for Rigid and Multilayer Printed Boards

    This specification covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic ...

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  • Specification for Metal Base Copper Clad Laminates for Rigid Printed Boards

    Standard [CURRENT] 2026-06-01

    IPC 4105:2026-06-01

    Specification for Metal Base Copper Clad Laminates for Rigid Printed Boards

    The IPC-4105 is a new document that covers the requirements for metal-base materials that are referred to as metal-based laminate listed in the specification sheets that are contained in the list ...

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  • Connected Factory Exchange (CFX); Version 2.1

    Standard [CURRENT] 2026-06-01

    IPC 2591:2026-06-01

    Connected Factory Exchange (CFX); Version 2.1

    IPC-2591 is a plug-and-play standard that defines a universal language for machine-to-machine, machine-to-business and business-to-machine communication. Backed by an open-source SDK for shop ...

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  • Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Conductors

    Standard [CURRENT] 2026-06-01

    IPC EIA/JEDEC J-STD-002F:2026-06-01

    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Conductors

    IPC-J-STD-002F prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires ...

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  • IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies; correcting the Misunderstandings on "Halogen-Free"

    Standard [CURRENT] 2007-09-19

    IPC WP/TR-584A:2007-09-19

    IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies; correcting the Misunderstandings on "Halogen-Free"

    This document summarizes the IPC position on the subject of "halogen-free" materials for the electronics industry. Its initial release was developed over a period of three years and this revision ...

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  • Sectional Design Standard for Rigid Organic Printed Boards

    Standard [CURRENT] 2020-10-01

    IPC 2222B:2020-10-01

    Sectional Design Standard for Rigid Organic Printed Boards

    IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures.

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  • Generic Requirements for Declaration Process Management

    Standard [CURRENT] 2026-06-01

    IPC 1751B:2026-06-01

    Generic Requirements for Declaration Process Management

    IPC-1751 establishes the foundational framework for exchanging declaration information across the electronics supply chain. It defines the common structure, data requirements and communication ...

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