Mechanical standardization of semiconductor devices - Part 6-18 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
German title
Mechanische Normung von Halbleiterbauelementen - Teil 6-18 : Allgemeine Regeln für die Erstellung von Gehäusezaeichnungen von SMD-Halbleitergehäussen - Konstruktionsleitfaden für Ball-Grid-Array (BGA)
Publication date
2010-08-01
Original language
French
Pages
23
Publication date
2010-08-01
Original language
French
Pages
23
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