Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010) (german version)
German title
Elektronikaufbauten auf Leiterplatten - Teil 6: Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode (IEC 61191-6:2010) (deutsche Fassung)
Publication date
2011-03-01
Original language
German
Pages
42
Publication date
2011-03-01
Original language
German
Pages
42
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