SN EN 61190-1-3+A1:2010-09

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

German title: Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
Publication date: 2010-09
Original language: German
Pages: 39

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Replacement amendments

This document has been replaced by: SN EN IEC 61190-1-3:2018-03 .

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