IPC Standards

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  • Specification for Multilayer Hybrid Circuits

    Standard [CURRENT] 1987-01

    IPC HM-860:1987-01

    Specification for Multilayer Hybrid Circuits

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  • Guidelines for Multichip Module Technology Utilization

    Standard [CURRENT] 1992-08

    IPC MC-790:1992-08

    Guidelines for Multichip Module Technology Utilization

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  • Guidelines for High Volume Microsection

    Standard [CURRENT] 1993-10

    IPC MS-810:1993-10

    Guidelines for High Volume Microsection

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  • SMEMA Standard Recipe File Format Specification

    Standard [CURRENT] 1999-03

    IPC 2531:1999-03

    SMEMA Standard Recipe File Format Specification

    Information

    This item will be ordered specially for you, therefore delivery may take 1 to 2 weeks.

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    Price on request

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  • Standard for Visual Optical Inspection Aids

    Standard [CURRENT] 1993-10

    IPC OI-645:1993-10

    Standard for Visual Optical Inspection Aids

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  • Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

    Standard [CURRENT] 1992-02

    IPC QF-143:1992-02

    Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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  • Specification for Finished Fabric Woven from Aramid for Printed Boards

    Standard [CURRENT] 1990-06

    IPC A-142:1990-06

    Specification for Finished Fabric Woven from Aramid for Printed Boards

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  • IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak

    Standard [CURRENT] 2018-05-01

    IPC WP-023:2018-05-01

    IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak

    IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure;

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  • Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

    Standard [CURRENT] 1996-07

    IPC D-279:1996-07

    Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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  • Certification of Facilities that Inspect/Test Printed Boards, Components and Materials

    Standard [CURRENT] 1997-11

    IPC QL-653A:1997-11

    Certification of Facilities that Inspect/Test Printed Boards, Components and Materials

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