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Standard [CURRENT] 2022-02-01
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
The IPC-9701B standard establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may ...
Accessibility
118.80 EUR VAT included
111.03 EUR VAT excluded
Troubleshooting for Printed Board Fabrication Processes
453.70 EUR VAT included
424.02 EUR VAT excluded
Standard [CURRENT] 2022-04-01
Terms and Definitions for Design and Manufacture of Printed Electronics
Standard [CURRENT] 2014-03-24
Selection and Application of Board Level Underfill Materials
This document provides users of underfill material with guidance in selecting and evaluating underfill material for assembly solder joints second-level interconnects. Underfill material is used to ...
211.90 EUR VAT included
198.04 EUR VAT excluded
Standard [CURRENT] 2014-05-02
Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities
Lead-free electronics continues to be a concern of the aerospace, defense, and high performance products (ADHP) industries. This is primarily due to the lack of data and knowledge to: thoroughly ...
Free of charge
Standard [CURRENT] 1988-03-01
Component Packaging & Interconnecting with Emphasis on Surface Mounting
This document examines key issues in advanced packaging techniques. Provides information on what types of parts are available, the techniques and processes necessary for their proper use, possible ...
Standard [CURRENT] 1992-11-01
Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
Guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic ...
165.90 EUR VAT included
155.05 EUR VAT excluded
Standard [CURRENT] 1990-11-01
Guidelines for Chip-on-Board Technology Implementation
Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on ...
Standard [CURRENT] 2022-01-01
Specification for Flexible Base Dielectrics for use in Flexible Printed Boards
The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and ...
Standard [CURRENT] 2021-11-30
Stencil Design Guidelines
The IPC-7525C standard provides guidance for the design and fabrication of stencils for solder paste and surface-mount adhesive with much of the content based on the experience of stencil ...
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