This document describes materials that can be used for the fabrication of embedded passive resistor devices within the finished printed circuit board substrate. It provides information on general ...

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

Surface Insulation Resistance (SIR) testing is a tool used not only for characterization testing of production processes such as solder masks, soldering flux, and conformal coatings, but also for ...

This standard specifies the XML schema that represents the intelligent data file format used to describe administration information related to ordering and specifying printed boards, printed board ...

This standard specifies the XML schema that represents the intelligent data file format used to describe design characteristics for manufacturing data description. This format may be used for ...

This standard specifies the XML schema that represents the intelligent data file format used to describe printed board fabrication data description. This format may be used for transmitting ...

This standard specifies the XML schema that represents the intelligent data file format used to describe part list product data. This format may be used for transmitting information between a ...

IPC-2316 offers printed board users and designers the necessary information for incorporating formed and placed embedded passive components into their applications. The history of embedded passive ...

This document provides guidelines for generating good quality holes in printed circuit boards (PCBs) made from a wide variety of materials. It addresses the following topics: Drill Bits, Tooling ...

This standard supersedes SMEMA 1.2. The purpose of this standard is to provide an equipment interface specification for board transfer manufacturing systems of surface-mounted printed circuit boards.