Energie- und Elektrotechnik

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  • Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment (IEC 60204-33:2009, modified); German version EN 60204-33:2011

    Standard [CURRENT] 2011-11

    DIN EN 60204-33:2011-11; VDE 0113-33:2011-11

    Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment (IEC 60204-33:2009, modified); German version EN 60204-33:2011

    This part of DIN EN 60204 (VDE 0113) applies to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of ...

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  • Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996

    Standard [CURRENT] 1997-08

    DIN EN 60617-5:1997-08

    Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes (IEC 60617-5:1996); German version EN 60617-5:1996

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  • Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024

    Standard [NEW] 2025-08

    DIN EN IEC 60747-15:2025-08

    Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 60747-15:2024); German version EN IEC 60747-15:2024

    from 168.30 EUR VAT included

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  • Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020 + COR1:2021); German version EN IEC 60747-17:2020 + AC:2021

    Standard [CURRENT] 2021-10

    DIN EN IEC 60747-17:2021-10; VDE 0884-17:2021-10

    Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020 + COR1:2021); German version EN IEC 60747-17:2020 + AC:2021

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  • Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003

    Standard [CURRENT] 2003-12

    DIN EN 60749-1:2003-12

    Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003

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  • Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002

    Standard [CURRENT] 2003-04

    DIN EN 60749-2:2003-04

    Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002

    from 58.30 EUR VAT included

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  • Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017

    Standard [CURRENT] 2018-01

    DIN EN 60749-3:2018-01

    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017

    from 87.90 EUR VAT included

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  • Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017

    Standard [CURRENT] 2017-11

    DIN EN 60749-4:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017

    The suitability of semiconductor components for different applications also depends on the climatic and mechanical environmental influences to which these components are exposed. The DIN EN 60749 ...

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  • Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023); German version EN IEC 60749-5:2024

    Standard [CURRENT] 2024-09

    DIN EN IEC 60749-5:2024-09; VDE 0884-749-5:2024-09

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2023); German version EN IEC 60749-5:2024

    41.72 EUR VAT included

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  • Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017

    Standard [CURRENT] 2017-11

    DIN EN 60749-6:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017

    The suitability of semiconductor components for different applications also depends on the climatic and mechanical environmental influences to which these components are exposed. The DIN EN 60749 ...

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