Energie- und Elektrotechnik

260 search results

  • Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017

    Standard [CURRENT] 2017-10

    DIN EN 60747-16-1:2017-10

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017

    This part of IEC 60747 provides the terminology, the ratings and characteristics, as well as the measuring methods for microwave integrated circuit power amplifiers. Compared to DIN EN 60747-16-1 ...

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  • Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017

    Standard [CURRENT] 2018-04

    DIN EN 60747-16-4:2018-04

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017

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  • Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020

    Standard [CURRENT] 2021-08

    DIN EN 60747-16-5:2021-08

    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020

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  • Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019

    Standard [CURRENT] 2021-08

    DIN EN IEC 60747-16-6:2021-08

    Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019

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  • Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023

    Standard [CURRENT] 2024-04

    DIN EN IEC 60747-16-7:2024-04

    Semiconductor devices - Part 16-7: Microwave integrated circuits - Attenuators (IEC 60747-16-7:2022); German version EN IEC 60747-16-7:2023

    This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit attenuators. Its application increases investment ...

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  • Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022); German version EN IEC 60747-16-8:2023

    Standard [CURRENT] 2024-04

    DIN EN IEC 60747-16-8:2024-04

    Semiconductor devices - Part 16-8: Microwave integrated circuits - Limiters (IEC 60747-16-8:2022); German version EN IEC 60747-16-8:2023

    This part of IEC 60747 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit limiters. Its application increases investment ...

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  • Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 60747-16-9:2024); German version EN IEC 60747-16-9:2024

    Standard [AVAILABLE PRE-PUBLICATION] 2026-10

    DIN EN IEC 60747-16-9:2026-10

    Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 60747-16-9:2024); German version EN IEC 60747-16-9:2024

    And replaced by 2026-10 for: DIN EN IEC 60747-16-9:2022-06

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  • Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English

    Draft standard 2022-06

    DIN EN IEC 60747-16-9:2022-06 - Draft

    Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English

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  • Low-voltage switchgear and controlgear - Part 10: Semiconductor Circuit-Breakers (IEC 121A/635/CDV:2025); German and English version prEN IEC 60947-10:2025

    Draft standard 2026-06

    DIN EN IEC 60947-10:2026-06; VDE 0660-122:2026-06 - Draft

    Low-voltage switchgear and controlgear - Part 10: Semiconductor Circuit-Breakers (IEC 121A/635/CDV:2025); German and English version prEN IEC 60947-10:2025

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  • Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016

    Standard [CURRENT] 2017-04

    DIN EN 62047-25:2017-04

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016

    The main structural materials for MEMS, microcomponents and so on have special properties such as dimensions in the micrometer range, material manufacturing processes using layer deposition and ...

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